 |
 |
Capabilities
We specialize in providing custom assembly solutions
for PCB assemblies, electronic products, medical devices and box builds.
We possess the systems, tools, technologies and talent
to deliver the highest quality product on time at
the lowest cost possible.
|
Our Lean
Manufacturing and Statistical Process Control (SPC) initiatives
improve our efficiencies while our focus on quality and service
ensures we are able to offer the lowest cost with the highest
level of performance.
We exceed
industry standards through innovation and commitment to excellence.
Our highly skilled long-term managers and operators are trained
to IPC-A-610 Class 3 standards, and our QA Manager has received
his IPC J-STD-001 Class 3 Application Specialist Certification,
which allows for in-house training and certification of all
Sibex solderers and inspectors as IPC J-STD-001 Class 3 specialists,
allowing them to perform military IPC Class 3 work.
As an
additional value-added service, Sibex provides mechanical,
electrical and test engineering development support for
our established customers.
|
| .................................................................................................................................................................................... |
Manufacturing Summary
• UL Registered ISO 9001:2000 facility with J-STD-001 Class
3 soldering capabilities
• Fully automated advanced manufacturing technology with
RoHS lead-free capabilities
• Highly skilled long-term managers and operators trained
to IPC-A-610 standards
• Over 45,000 square feet of manufacturing space
• Production capacity available with quick Time-to-Market
initiatives
• Lean manufacturing and statistical process control (SPC)
initiatives
• MRP system for supply chain control and real-time QC monitoring
• Advanced Fuji SMT equipment - 80,000 placements/hr at
99% accuracy to 1mil pitch (0402, QFP, FPGA, BGA, uBGA with
X-ray QC inspection)
• Four (4) fully-automated in-line SMT lines with Vitronics
IR reflow ovens (double-sided reflow capability)
• Automated DIP, Axial and Radial Plated Through Hole (PTH)
equipment
• Two (2) wave solder machines and one (1) dedicated lead-free
(RoHS) wave solder machine
• Multiple soldering and processing techniques (lead free,
no-clean, aqueous, conformal coating, potting, baking)
• Functional testing or Genrad ICT testing with burn-in
• Product and component-level traceability
• Disaster Recovery Plan - Multiple Manufacturing Sites
|
|
| |
|
|
 |
