 |
Manufacturing
Summary
• UL Registered ISO 9001:2000 facility with J-STD-001
Class 3 soldering capabilities
• Fully automated advanced manufacturing technology
with RoHS lead-free capabilities
• Highly skilled long-term managers and operators
trained to IPC-A-610 standards
• Over 45,000 square feet of manufacturing space
• Production capacity available with quick Time-to-Market
initiatives
• Lean manufacturing and statistical process control
(SPC) initiatives
• MRP system for supply chain control and real-time QC monitoring
• Advanced Fuji SMT equipment - 80,000 placements/hr
at 99% accuracy to
..1mil pitch (0402, QFP,
FPGA, BGA, uBGA with X-ray QC inspection)
• Four (4) fully-automated in-line SMT lines with
Vitronics IR reflow ovens (double-
..sided reflow capability)
• Automated DIP, Axial and Radial Plated Through
Hole (PTH) equipment
• Two (2) wave solder machines and one (1) dedicated
lead-free (RoHS) wave
..solder machine
• Multiple soldering and processing techniques
(lead free, no-clean, aqueous,
..conformal coating, potting,
baking)
• Functional testing or Genrad ICT testing with
burn-in
• Product and component-level traceability
• Disaster Recovery Plan - Multiple Manufacturing
Sites
|
|
| |
|
| |
| |
|
|
 |
